SiC Wafer Polishing Market worth $2.2 billion by 2028 – At a CAGR of 37.5%

The According to a market research report, the “SiC Wafer Polishing Market by Product Type (Abrasive Powders, Polishing Pads, Diamond Slurries, Colloidal Silica Suspensions), application, Process, & Region (North America, Europe, APAC, South America, MEA) – Global Forecast 2028″, is expected to grow at a CAGR of 37.5% during the forecast period, from an estimated USD 0.4 billion in 2023 to USD 2.2 billion by 2028. The global  Sic wafer polishing market is driven by the Growing Consumption of Consumer Electronics, as well as the Growing demand for SIC-based power devices can drive the market for  Sic wafer polishing centrifuges due to the Adoption of SiC wafers in radio frequency (RF) devices, Growing investments in SiC research and development.

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• 127 Market data Tables
• 48 Figures
• 168 Pages and in-depth TOC on “SiC Wafer Polishing Market – Global Forecast to 2028”

This report also provides a comprehensive analysis of the companies listed below:

Major players operating in the  Sic wafer polishing such as  Kemet International (UK), Entegris (US), Fujimi Corporation (Japan), and Saint-Gobain(US). These companies have reliable manufacturing facilities as well as strong distribution networks across key regions, such as North America, Europe, and Asia Pacific. They have an established portfolio of reputable products and services, a robust market presence, and strong business strategies. Furthermore, these companies have a significant market share, products with wider applications, broader geographical use cases, and a larger product footprint. Experience and support of government mandates have contributed to the growth of the semiconductor Industry in this region.

Recent Developments in SiC Wafer Polishing Market Industry

1. December 2019 Entegris Completes Acquisition of CABOT MICROELECTRONICS; the acquisition is helping Cabot Microelectronics become more critical to its semiconductor industry customers and touch more parts of its production processes.
2. In November  2021, SKC will borrow 1.5 trillion won from Korea Development Bank (KDB) to expand its secondary battery and eco-friendly materials business.
3. July 2021 Fujifilm Announces $350 Million Investment in its U.S. Electronic Materials Business; the planned U.S. investment will support the development and manufacture of Fujifilm’s broad range of semiconductor materials and chemicals, particularly Chemical Mechanical Polishing (CMP) slurry and Photolithography-related high purity materials.
4. In July 2023, SKC decided to acquire ISC, a semiconductor test solution provider.

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The Sic wafer polishing market, by product type, is segmented into polishing pads, diamond slurries, abrasive powder, colloidal silica suspension, and others. Globally, diamond slurries dominated the  Sic wafer polishing market due to their unrivaled effectiveness in tackling the issues provided by SiC wafers. Polishing pads provide high material removal rates and homogeneous abrasive action, resulting in precise polishing and superior planarity. Their sophisticated materials and unique architectures offer long-term durability, reducing downtime and increasing production for manufacturers. Furthermore, the adaptability of polishing pads in fitting different wafer sizes and applications makes them a popular choice among a wide range of customers. Continuous R&D efforts improve their performance even further, cementing their position as the leading choice for SiC wafer polishing needs worldwide. Due to these reasons Polishing Pads segment expected to register highest CAGR during forecast period.

Sic wafer polishing market, by application segmented into power electronics, light-emitting diodes, RF and microwave devices, telecommunication devices, and others. Power electronics holds the largest market share in the  Sic wafer polishing centrifuge market primarily due to the sudden increase in popularity and demand for energy-efficient electronics. Due to their higher thermal conductivity and broad bandgap, SiC wafers are particularly well suited for power electronic components that must work well at high temperatures. The need for high-power SiC-based devices has greatly increased with the growing use of electric cars, renewable energy sources, and industrial applications. In order to meet the demands of the power electronics industry, this has led to a significant increase in the SiC wafer polishing market, solidifying its position as the market’s largest segment.

The  Sic wafer polishing market, by process type, includes mechanical polishing, chemical-mechanical polishing (CMP), electropolishing, chemical polishing, plasma-assisted polishing, and others. The dominance of chemical mechanical polishing (CMP) in the Sic wafer polishing market is due to its extraordinary skills in handling SiC’s brittleness and hardness. Precision thickness and surface polish, essential for high-quality SiC wafers used in power electronics and other applications, are ensured by CMP’s ability to precisely control the material removal rate. Because of the process’s ability to planarize surfaces, device performance and yield are improved. In the semiconductor sector, CMP is a well-established and mature process that benefits from specialized slurries and pads made for SiC wafer polishing, allowing for reliable and effective mass production.

Asia Pacific region is experiencing the largest market share in the  Sic wafer polishing market due to its thriving electronics and semiconductor businesses. The area holds a leading position in the production of semiconductors, headed by nations like China, Japan, South Korea, and Taiwan, which promotes a significant demand for SiC wafers used in various electronic applications. Additionally, Asia-Pacific gains from a vast network of R&D and semiconductor fabrication facilities that fuel improvements in SiC wafer polishing methods. In addition, the region’s supremacy in the market is a result of supportive governmental policies, rising R&D expenditures, and a knowledgeable labor force.

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