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With a CAGR of 7.4%, the bonding sheet market will be worth USD 551 million by 2027.

Published: March 23, 2023
According to a market research report, the Bonding Sheet Market by Adhesive Material (Polyesters, Polyimides, Acrylics, Modified Epoxies), Application (Electronics/Optoelectronics, Telecommunication/5G Communication, Automotive, Building & Construction and Region – Global Forecast to 2027“, The global bonding sheet market size is projected to grow from USD 386 million in 2022 to USD 551 million by 2027, at a CAGR of 7.4% between 2022 and 2027 A bonding sheet is a sheet or film with an adhesive layer on one side meant for bonding purposes or surface coating. It is sold with a removable paper release liner to prevent it from adhering prematurely. It is typically smooth and shiny but is also available in textured varieties. It is also called sheet adhesive, pure adhesive, or simply adhesive. A bonding sheet is primarily used to bond flexible inner layers or rigid cap layers in multi-layer laminations. It is widely used to bond flexible circuits to rigid-flex boards during the fabrication of rigid–flex PCBs, heat sinks, and bond stiffeners. Other than these, it finds applications in decorative lamination.

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  • 219 Market data Tables
  • 55 Figures
  • 226 Pages and in-depth TOC on “Bonding Sheet Market – Global Forecast to 2027″
This report also provides a comprehensive analysis of the companies listed below:

Major players operating in the global bonding sheet market include Arisawa Manufacturing Co. (Japan), DuPont (US), NIKKAN INDUSTRIES Co., Ltd. (Japan), Dexerials Corporation (Japan), Nitto Denko Corporation (Japan), Showa Denko Materials Co., Ltd. (Japan), Toray Industries, Inc. (Japan), NAMICS Corporation (Japan), and Shin-Etsu Polymer Co., Ltd. (Japan) among many others.

Merger & acquisitions, investments & expansions, partnerships & collaborations, and new product developments are some of the major strategies adopted by these key players to enhance their positions in the Bonding Sheet Market.

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Arisawa Manufacturing Co., Ltd. is one of the leading players in the field of electronic/optoelectronic materials. The company manufactures cover lays, laminates, adhesive sheets, and other electronics materials. It offers bonding sheet adhesives under the brand interlayer adhesive sheet through the electronics related materials business segment. Arisawa Manufacturing Co., Ltd. provides bonding sheet primarily for FPC applications under the FPC materials product portfolio for electronics and telecommunication applications.

Nitto Denko Corporation develops core technologies for adhesive based products and manufactures bonding sheets, insulating materials, automotive electronics, and other electronics products. It offers bonding sheet under the brand FB-ML4 through the Industrial Tape business segment. Nitto Denko Corporation manufactures acrylic and polyester bonding sheet ideal for electronics/optoelectronics, home appliances, LED substrate, and other applications. The company has manufacturing facilities in Japan and other Asia Pacific countries such as China, Thailand, Korea, and others.

Another important player in the bonding sheet market is DuPont (US) is a prominent bonding sheet manufacturing company engaged in R&D, manufacturing, processing, marketing, and supplying of bonding sheet. Its product portfolio includes Pyralux brand of bonding sheet in various grades and adhesive thickness for electronics, telecommunication, automotive, and other applications. The company has a global business presence with manufacturing location and sales offices in Asia Pacific, Europe, North America, South America, and the Middle East & Africa.

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